Database providing access to the High Technology Network's industrial research offering: research competences, type of analyses and tests available at the Laboratories. Companies can consult the Catalogue to find Laboratories and researchers that match their needs.
Competence
Ad hoc networks
Adaptive QoS
Additive manufacturing processes (3D printing, SLA rapid prototyping, etc.)
Cladding
Conventional welding processes (arc, TIG, MIG / MAG, resistance, etc.)
DSPs and Embedded Processors
Future internet
Generation and optimization of the part program
Hardware Design Flow
Heat treatments of conventional and not conventional metal alloys
Ipv6 networks
Machining processes for metal removal (turning, milling, drilling, reaming, broaching, grinding, etc.)
Massive deformation processes (forging, pressing, rolling mill, extrusion, drawing, etc.)
Melting processes (in sand, in shell, die casting, investment casting, etc.)
Microprocessing (micro-milling, -drilling, -laser, -waterjet, etc.)
Network and service management
Network planning and design
Next Generation network
Non-conventional machining processes (laser, plasma, waterjet, chemical and electrochemical , ultrasonic, electrical discharge, etc.)
Optical networks and systems
Optimization of energy consumption
Processes of ceramic materials production / machining (massive, dense / porous, thick films, etc.)
Processes of powder sintering
Processes of production / machining of products in glass
Processes of production / machining of products in polymer materials
Processes of production / machining of products of composite materials
Processes of recovery and recycling of materials / products
Production planning (cell and processing lines configuration, scheduling, reconfigurability, adaptivity, lean production, etc.)
Programmable Devices (FPGA, GA, CPLD)
Real-time Operating Systems
Reliability and quality of the finished product / process
Scalable and adaptive networks
Sensor networks and WSN
Sensor-based systems
Session control for Internet and Telco convergence
Sheet metal forming processes (stamping, cutting, bending, hydroforming, etc.)
Surface treatments of chemical and physical functionalization of materials (texturing, SOL-GEL, plasma activation, etc.)
Systems on Chips (SoC and ASIC)
Treatments of surface modification for metallic materials (thermochemical, conversion, CVD, PVD, electroplating, etc.)
Unconventional welding processes (laser, plasma, ultrasound, electron beam, etc.)