Database providing access to the High Technology Network's industrial research offering: research competences, type of analyses and tests available at the Laboratories. Companies can consult the Catalogue to find Laboratories and researchers that match their needs.
Competence
Analysis and preliminary planning: Design project management (PDM / PLM)
Analysis of packaging regulations
Analysis of possible reuse and recycle of packaging materials
Assessment of the environmental impact (LCA) of one or more packagings
Characterization of polymeric material by differential scanning calorimetry and NMR
Chemical analyses for food quality and safety (off-flavours, plasticizers)
Conceptual design: analysis of customer needs and development of alternative concepts
Conceptual design: graphic rendering, augmented reality, virtual reality
Consultation for techniques of Design of experiments (DoE)
Contamination analysis of pre- and post-extrusion recycled material
Design for Assembly / assembly analysis, tolerance chains and technical product documentation (CAD / CAT)
Design for Engineering Materials: methods and techniques for the exploitation of engineered materials
Design for Ergonomics (Digital Mock Up, HMI - Human Machine Interface, User centered design, User experience, Usability)
Design for Manufacturability / Analysis of technological processes for metal machining (CAM)
Design for Manufacturability / Analysis of technological processes for metals (CAE): castings, plastic deformation, sheet-metal forming, injection molding
Design for Manufacturability / Analysis of technological processes for polymers (CAE): plastic deformation, injection molding, extrusion, thermoforming
Design for Sustainability (LCA, energy efficiency)
Design to cost, fault tolerance, robust design
Detail design: Design archetypes , parametric models (CAD)
Detail design: Dynamic analysis and NVH (Noise, Vibration, Harshness)
Detail design: internal and external three-dimensional thermo - fluid dynamics of components, machines and systems (CFD)
Detail design: lumped parameter and one-dimensional fluid dynamic analysis of circuits, components, machines and systems
Detail design: lumped parameter and one-dimensional static and dynamic electromechanical analysis of circuits, components, machines and systems
Detail design:static, dynamic, elastodynamic structural, thermo structural and crash analysis (FEM)
Development of new active and intelligent packaging
Effect of migration from packaging to food and vice-versa: analysis and study
Evaluation of microorganism development on raw materials and packaged foods
Evaluation of packaging mechanical resistance with numeric simulation and experimental trials
Film thermoformation and food packaging in modified atmosphere
Gas permeability reduction in packaging materials
Global migration analysis of one or more packagings
Integrated design and programming of robotic systems and automatic machines (flexible, modular, configurable, adaptive systems)
Life cycle assessment for food packaging
Mechanical tests on packaging and packaging materials
New material and technique study for bio- and eco-compatible packaging films
New materials to reduce environment impact
Optimized methods for homologation of packaging from recycled materials
Packaging innovation to enhance food shelf-life
Property enhancement of innovative biodegradable materials
Quality control of products with electronic noses