Database providing access to the High Technology Network's industrial research offering: research competences, type of analyses and tests available at the Laboratories. Companies can consult the Catalogue to find Laboratories and researchers that match their needs.
Competence
Additive manufacturing processes (3D printing, SLA rapid prototyping, etc.)
Algorithms and systems for fault detection
Algorithms for fault identification
Analysis of packaging regulations
Analysis of possible reuse and recycle of packaging materials
Analysis of the time to failure of components and systems
Assessment of the environmental impact (LCA) of one or more packagings
Characterization of polymeric material by differential scanning calorimetry and NMR
Chemical analyses for food quality and safety (off-flavours, plasticizers)
Cladding
Consultation for techniques of Design of experiments (DoE)
Contamination analysis of pre- and post-extrusion recycled material
Conventional welding processes (arc, TIG, MIG / MAG, resistance, etc.)
Design for Maintenance e e-Maintenance
Development of new active and intelligent packaging
e-maintenance: remote management of maintenance and fault
Effect of migration from packaging to food and vice-versa: analysis and study
Evaluation of microorganism development on raw materials and packaged foods
Evaluation of packaging mechanical resistance with numeric simulation and experimental trials
Failure Mode and Effect Analysis - FMEA
Fault tolerant control
Fault Tree Analisys - FTA
Film thermoformation and food packaging in modified atmosphere
Gas permeability reduction in packaging materials
Generation and optimization of the part program
Global migration analysis of one or more packagings
Heat treatments of conventional and not conventional metal alloys
Life cycle assessment for food packaging
Machining processes for metal removal (turning, milling, drilling, reaming, broaching, grinding, etc.)
Massive deformation processes (forging, pressing, rolling mill, extrusion, drawing, etc.)
Mechanical tests on packaging and packaging materials
Melting processes (in sand, in shell, die casting, investment casting, etc.)
Microprocessing (micro-milling, -drilling, -laser, -waterjet, etc.)
New material and technique study for bio- and eco-compatible packaging films
New materials to reduce environment impact
Non-conventional machining processes (laser, plasma, waterjet, chemical and electrochemical , ultrasonic, electrical discharge, etc.)
Optimization of energy consumption
Optimized methods for homologation of packaging from recycled materials
Packaging innovation to enhance food shelf-life
Predictive maintenance