Database providing access to the High Technology Network's industrial research offering: research competences, type of analyses and tests available at the Laboratories. Companies can consult the Catalogue to find Laboratories and researchers that match their needs.
Competence
Additive manufacturing processes (3D printing, SLA rapid prototyping, etc.)
Analysis of packaging regulations
Analysis of possible reuse and recycle of packaging materials
Assessment of the environmental impact (LCA) of one or more packagings
Biosensors (enzymes, cells, antibodies,analyte and ions)
Characterization of polymeric material by differential scanning calorimetry and NMR
Chemical analyses for food quality and safety (off-flavours, plasticizers)
Chemical, gas, indoor air quality sensors, Lab-on-Chip
Cladding
Consultation for techniques of Design of experiments (DoE)
Contamination analysis of pre- and post-extrusion recycled material
Conventional welding processes (arc, TIG, MIG / MAG, resistance, etc.)
Detectors of ionizing radiation (X-rays, gamma, radon)
Development of new active and intelligent packaging
Effect of migration from packaging to food and vice-versa: analysis and study
Electrical, power and magnetic sensors
Energy harvesting
Evaluation of microorganism development on raw materials and packaged foods
Evaluation of packaging mechanical resistance with numeric simulation and experimental trials
Film thermoformation and food packaging in modified atmosphere
Gas permeability reduction in packaging materials
Generation and optimization of the part program
Global migration analysis of one or more packagings
Heat treatments of conventional and not conventional metal alloys
Integrated electronics of control and front-end, with analysis of the accuracy of the acquisition chain
Life cycle assessment for food packaging
Machining processes for metal removal (turning, milling, drilling, reaming, broaching, grinding, etc.)
Massive deformation processes (forging, pressing, rolling mill, extrusion, drawing, etc.)
Mechanical sensors (accelerometers, gyroscopes, strain gauges, microphones); Tactile , force, torque sensors. Doppler laser sensors
Mechanical tests on packaging and packaging materials
Melting processes (in sand, in shell, die casting, investment casting, etc.)
Microprocessing (micro-milling, -drilling, -laser, -waterjet, etc.)
New material and technique study for bio- and eco-compatible packaging films
New materials to reduce environment impact
Non-conventional machining processes (laser, plasma, waterjet, chemical and electrochemical , ultrasonic, electrical discharge, etc.)
Optical sensors, waveguides and photonic structures, optics fibers
Optimization of energy consumption
Optimized methods for homologation of packaging from recycled materials
Packaging innovation to enhance food shelf-life
Packaging integration