Database providing access to the High Technology Network's industrial research offering: research competences, type of analyses and tests available at the Laboratories. Companies can consult the Catalogue to find Laboratories and researchers that match their needs.
Competence
Acquisition and pre-processing of signals for model identification
Analysis of packaging regulations
Analysis of possible reuse and recycle of packaging materials
Assessment of the environmental impact (LCA) of one or more packagings
Biosensors (enzymes, cells, antibodies,analyte and ions)
Characterization of polymeric material by differential scanning calorimetry and NMR
Chemical analyses for food quality and safety (off-flavours, plasticizers)
Chemical, gas, indoor air quality sensors, Lab-on-Chip
Consultation for techniques of Design of experiments (DoE)
Contamination analysis of pre- and post-extrusion recycled material
Continuous-time and discrete-time mathematical modeling of systems and processes
Detectors of ionizing radiation (X-rays, gamma, radon)
Development of new active and intelligent packaging
Discrete events mathematical modeling of systems and processes
Effect of migration from packaging to food and vice-versa: analysis and study
Electrical, power and magnetic sensors
Energy harvesting
Evaluation of microorganism development on raw materials and packaged foods
Evaluation of packaging mechanical resistance with numeric simulation and experimental trials
Film thermoformation and food packaging in modified atmosphere
Finite element simulation (FEM)
Formal languages for systems modeling (Unified Modeling Language-UML and SysML-System Modeling Language)
Gas permeability reduction in packaging materials
Global migration analysis of one or more packagings
Identification of models and parameters estimation
Infinite-dimensional mathematical modeling of systems
Integrated electronics of control and front-end, with analysis of the accuracy of the acquisition chain
Life cycle assessment for food packaging
Mechanical sensors (accelerometers, gyroscopes, strain gauges, microphones); Tactile , force, torque sensors. Doppler laser sensors
Mechanical tests on packaging and packaging materials
Modeling of the collision of bodies in mechanical systems
New material and technique study for bio- and eco-compatible packaging films
New materials to reduce environment impact
Non-parametric modeling (neural networks, etc.)
Optical sensors, waveguides and photonic structures, optics fibers
Optimized methods for homologation of packaging from recycled materials
Packaging innovation to enhance food shelf-life
Packaging integration
Property enhancement of innovative biodegradable materials
Quality control of products with electronic noses